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Fujikon Industrial Co. 更多：https://www.bmcx.com/ ,Ltd. PCB Specification Part Number: 42-5131-0005-4 Version: 01 Developed Stage: D Board Type: ü Single-Layer Class: Ⅰ Ⅱ Ⅲ Double-Layer ü Multiple-Layer Number Of Layers: 1 Other(Pls Specify) Board Size: 10.5 x 20 mm Panel Size: x mm Number of Boards Per Panel: 1 Minimum Trace Width 0.3 mm Minimum Insulation Distance 0.2 mm Material: ü FR-4 Material Thickness: 0.8mm CEM-1 1.0mm CEM-3 1.6mm Other (Pls Specify) Other ü "Copper Thickness (Finished)" Outer Layer: 18um 35um 70um Other Pls Specify) 1 OZ Inner Layer: 18um 35um 70um Other Pls Specify) Copper Thickness oz "Solder Mask: Yes ü No" ü Top Side Only Solder Mask Color: Green Blue Bottom Side Only ü Red Black Both Side Other (Pls Specify) "Silk Screen Printing: Yes ü No" ü Top Side Only Silk Screen Color: ü White Yellow Bottom Side Only Red Black Both Side Other(Pls Specify) Date Marking: ü Yes "UL Marking:" ü Yes Logo Marking ü Yes No No No Surface Finishes: HAL OSP Selective Hard Gold ü Immersion Gold Gold Flash Immersion Sliver Immersion Tin Electroless Copper Electroless Gold Electroless Nickel Other (Pls Specify) Safety Requirement: ü UL94-V0 UL94-V1 UL94-V2 Other(Pls Specify) Environmental Requirement: ü RoHS REACH(Refer to Control Material List) Other (Pls Specify) Machining(Finished Board Delivered As) Single Board Panel with Fixing Tabs ü Panel with V-cut Other (Pls Specify) Other Requirements: "1、FPC完成板厚度:見CAD檔； 2、白色絲印； 3、表面處理：沉金； 4、 " Design Engineer: 姜孝生 Date: 2012-7-4 Review: Date: Approval: Date: