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4 Build Up 4.1 Board Outline file BRD.art - POS - Board Outline 4.2 Artwork files SST.art -POS- Component Notation Top Layer SMT.art -NEG- Solder Mask Top Layer CLT.art -POS- CoverLay Top Layer CGT.art -POS- Contact Gold(Hard Au) Top Layer TOP.art -POS- Cu Layer Top Layer Substrate -TBD -TBD(Mfr / Material) before MP(See Note 1) L2.art -POS- Cu Layer Inner Layer Substrate - - L3.art -POS- Cu Layer Inner Layer Substrate - - L4.art -POS- Cu Layer Inner Layer Substrate - - L5.art -POS- Cu Layer Inner Layer Substrate - - BOTTOM.art -POS- Cu Layer Bottom Layer CGB.art -POS- Contact Gold(Hard Au) Bottom Layer CLB.art -POS- CoverLay Bottom Layer SMB.art -NEG- Solder Mask Bottom Layer SSB.art -POS- Component Notation Bottom Layer *Note 1: Manufacturer & Material information shall be implemented in this PCB Specification before Mass Production are allowed to be started. (LDPP = Laser Drillable PrePreg) Overall FPC thickness: x.xx mm See Section 4.3 "Adhesive 更多：https://www.bmcx.com/ , Shield and Stiffener