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TNY263-268 Key Application Considerations TinySwitch-II vs. TinySwitch Table 2 compares the features and performance differences between the TNY254 device of the TinySwitch family with the TinySwitch-II family of devices. Many of the new features eliminate the need for or reduce the cost of circuit components. Other features simplify the design and enhance performance. *Not available. ** See typical performance curves. Table 2. Comparison Between TinySwitch and TinySwitch-II. Design Output Power Table 1(front page)shows the practical continuous output power levels that can be obtained under the following conditions: 1. The minimum DC input voltage is 90 V or higher for 85 VAC input, or 240 V or higher for 230 VAC input or 115 VAC input with a voltage doubler. This corresponds to a filter capacitor of 3 μF/W for universal input and 1 μF/W for 230 VAC or 115 VAC with doubler input. Function TinySwitch TinySwitch-II TinySwitch-II TNY254 TNY263-268 Advantages Switching Frequencyand Tolerance Temperature Variation (0-100 °C)** 44 kHz ±10% (at 25 °C) +8% 132 kHz ±6% (at 25 °C) +2% . Smaller transformer for low cost . Ease of design . Manufacturability . Optimum design for lower cost Active Frequency Jitter N/A* ±4 kHz . Lower EMI minimizing filter component costs Transformer Audible Noise Reduction N/A* Yes–built into controller . Practically eliminates audiblenoise with ordinary dip varnishedtransformer – no specialconstruction or gluing required Line UV Detect N/A* Single resistorprogrammable . Prevents power on/off glitches Current Limit Tolerance Temperature Variation (0-100 °C)** ±11% (at 25 °C) -8% ±7% (at 25 °C) 0% . Increases power capability andsimplifies design for high volume manufacturing Auto-Restart N/A* 6% effective on-time . Limits output short-circuit currentto less than full load current - No output diode size penalty . Protects load in open loop faultconditions - No additional componentsrequired BYPASS Pin Zener Clamp N/A* Internally clamped to6.3 V . Allows TinySwitch-IIto be powered from a low voltage biaswinding to improve efficiency and to reduce on-chip powerdissipation DRAIN Creepage atPackage 0.037 in. / 0.94 mm 0.137 in. / 3.48 mm . Greater immunity to arcing as aresult of dust 更多：https://www.bmcx.com/ , debris or other contaminants build-up 10 G